封装质量主管
发布日期: 2015-01-28

基本信息:

  • 汇报对象:部门经理
  • 下属人数:2人
  • 所属行业: 电子技术/半导体/集成电路
  • 所属部门:QA
  • 企业性质:外商独资·外企办事处
  • 企业规模:500-999人

职位描述:

Responsibilities:
1. Work as the technical expert with in-depth understanding of major Assembly and Foundry technologies to effectively asses and manage sub-con quality risk and issues identification, escalation and resolution with both QA and sub-con teams
2. Help analyze and diagnose sub-con quality issues escalation and resolution with sub-con engineering and QA team
3. Project-Manage Assembly and Foundry 8D/SCAR review and closure in customer quality incidents
4. Work as a core member of the QA team, define, track and analyze Assembly and Foundry quality management KPI, and drive for higher quality standard across all sub-con
5. Assist sub-con auditing
Requirements: 
1. Basic in EE or physics, Msc preferred
2. Minimum of 6 years working experience in Semiconductor IC Assembly, Foundry, Prodcut Engineering or Failure Analysis
3. Strong Quality Management experience with hands-on skills in quality management methodologies, such as TMQ, 6Sigma and SPC
4. Strong analytical and project management skills

岗位要求:

  • 学历要求:本科或以上
  • 性别要求:不限
  • 语言要求:英语 + 普通话
  • 专业要求:不限
  • 年龄要求:28-40
  • 工作年限:5年以上

薪酬福利:

  • 职位年薪:20-30万
  • 薪资构成:基本薪资
  • 年假福利:国家标准
  • 社保福利:国家标准

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